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Pioneer-ONE 应用文章列表，持续更新中.....

2024-10-30

目前使用Pioneer-ONE 发表的部分文章参考如下：

·"Quantifying Interfacial Bonding Using Thermal Boundary Conductance at Cubic Boron Nitride/Copper Interfaces with a Large Mismatch of Phonon Density of States." ACS Appl Mater Interfaces 15, no. 28 (Jul 19 2023): 34132-44. Chen, N., K. Yang, Z. Wang, B. Zhong, J. Wang, J. Song, Q. Li, et al.

·"Enhancing Interfacial Heat Conduction in Diamond-Reinforced Copper Composites with Boron Carbide Interlayers for Thermal Management." Composites Part B: Engineering 287 (2024). Cui, Shuai, Fangyuan Sun, Dazheng Wang, Xing Zhang, Hailong Zhang, and Yanhui Feng.

·"A Strategy for Enhancing Interfacial Thermal Transport in Ga2O3-Diamond Composite Structure by Introducing an AlN Interlayer." Nano Energy 132 (2024). Gu, Lin, Yuan Li, Yi Shen, Ruo-Yun Yang, Hong-Ping Ma, Fangyuan Sun, Yuanhui Zuo, et al.

·"Investigation of Gallium Oxide Thin Film Hetero-Integrated with Bulk Diamond Via Atomic Layer Deposition." Applied Surface Science 641 (2023). Gu, Lin, Hong-Ping Ma, Yuan Li, An-Feng Wang, Wen-Jie Chen, Zhuo-Rui Tang, Yi Shen, et al.

·"The Influence of Annealing Temperature on the Interfacial Heat Transfer in Pulsed Laser Deposition-Grown Ga2O3 on Diamond Composite Substrates." C 10, no. 3 (2024). Gu, Lin, Yi Shen, Wenjie Chen, Yuanhui Zuo, Hongping Ma, and Qingchun Zhang.

·"Synthesis of Nano-Diamond Film on GaN Surface with Low Thermal Boundary Resistance and High Thermal Conductivity." Carbon 229 (2024). Hao, Zhiheng, Ke Huang, Kexin Deng, Fangyuan Sun, Jinlong Liu, Liangxian Chen, Soumen Mandal, et al.

·"Interdiffusion Mechanism and Thermal Conductance at the Interfaces in Cu-to-Cu Bonds Achieved by Coating Nanolayers." Surfaces and Interfaces 46 (2024). Jiang, Xiaofan, Zeming Tao, Yuan Li, Fangyuan Sun, Daquan Yu, and Yi Zhong.

·"Enhancing Thermal Conductance between Graphene and Epoxy Interfaces through Non-Covalent Cation-Π Interactions." Carbon 226 (2024). Lu, Jiaxin, Yongsheng Fu, Yifan He, Kun Zheng, Fangyuan Sun, Jingnan Zhang, Xinyu Cao, and Yongmei Ma.

·"Enhanced through-Plane Thermal Conductivity of Graphene Membranes by the Interlayer Microstructure Manipulation: Multiscale Numerical Simulations and Experimental Verifications." Journal of Alloys and Compounds 1003 (2024). Tong, Yigang, Xueliang Wang, Xin Wang, Yaping Wang, Yongli Guo, Fangyuan Sun, and Yuan Li.

·"Interface Deciphering for Highly Interfacial Adhesion and Efficient Heat Energy Transfer." Applied Physics Letters 123, no. 15 (2023). Wang, Shuting, Zhenghong Jiang, Linlin Ren, Xiaoliang Zeng, and Rong Sun.

·"Correlating Young's Modulus with High Thermal Conductivity in Organic Conjugated Small Molecules." Small 20, no. 21 (May 2024): e2309338. Zeng, J., T. Liang, J. Zhang, D. Liu, S. Li, X. Lu, M. Han, et al.

·"A Bioinspired Polymer Composite with Tough, Fatigue-Resistant Adhesion, and High Interfacial Thermal Conductance Via Interfacial Crosslinking." Chemical Engineering Journal 495 (2024). Zeng, Xiangliang, Jianfeng Fan, Xiaoliang Zeng, Cong Yang, and Xinnian Xia.

·"Adhesion Energy-Assisted Low Contact Thermal Resistance Epoxy Resin-Based Composite." Langmuir 40, no. 15 (Apr 16 2024): 8108-14. Zhang, C., H. Cui, R. Guo, S. Chen, W. Li, Y. Han, S. Wang, et al.

·"Atomic Layer Deposited High Quality AlN Thin Films for Efficient Thermal Management." Journal of Materials Chemistry A 11, no. 40 (2023): 21846-56. Zhang, Wangle, Jianguo Li, Jiabin Fang, Longfei Hui, Lijun Qin, Ting Gong, Fangyuan Sun, and Hao Feng.

·"Improved Thermal Dissipation in a Mos2 Field-Effect Transistor by Hybrid High-K Dielectric Layers."ACS Applied Materials & Interfaces 16, no. 45 (2024/11/13 2024): 62527-36. Huang, Jian, Yifan Li, Xiaotong Yu, Zexin Liu, Fanfan Wang, Yue Yue, Rong Zhang, et al.

·"Anomalous Increase in Thermal Conductivity of Mg Solid Solutions by Co-Doping with Two Solute Elements." Acta Materialia 285 (2025/02/15/ 2025): 120708. Li, Zixin, Bo Hu, Fanjin Yao, Zhenfei Jiang, Junfu Zhang, Qianxi Zhang, Jiaxuan Han, et al.

·"Mechanochemistry-Mediated Colloidal Liquid Metals for Electronic Device Cooling at Kilowatt Levels." Nature Nanotechnology 20, no. 1 (2025/01/01 2025): 104-11. Wu, Kai, Zhengli Dou, Shibo Deng, Die Wu, Bin Zhang, Haobo Yang, Runlai Li, et al.

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